TM 31-1.0-6.0 Thermoelectric Module

TM 31-1.0-6.0
Thermoelectric Cooling Module

Specifications with Thot= 27°С

Part Number

Imax
A

Umax
V

Qcmax
W

∆Tmax
K

Dimensions (mm)
L x W x H

TM 31-1.0-6.0

6.0

3.9

13

70

15 x 15 x 3.1

Module Photo

TM 31-1.0-6.0

 

See tabs below for comprehensive information on TM 31-1.0-6.0

With a Qcmax of 13 watts (Th 27 °C), TM 31-1.0-6.0 is our most powerful single-stage thermoelectric module with a 15 x 15 mm footprint.

TM 31-1.0-6.0 may be used for cooling, heating and thermal stabilization and is employed in a wide range of applications including electro-optic/photonic, fiber optic, aerospace/military, telecommunications.

TM 31-1.0-6.0 is frequently used in electro-optic and photonic applications, including some lasers, detectors and sensors to maintain a constant temperature stabilizing the wavelength of the device or package.

Specifications (Hot-Side Temperature 27 °C)

Imax = 6.0 Amps (Imax is the maximum current at ΔTmax)

Vmax = 3.9 Volts (Vmax is maximum voltage at ΔTmax)

Qcmax = 13 Watts (Qcmax is maximum cooling capacity at Imax, Vmax and ΔT = 0 °C)

ΔTmax = 70 °C (ΔTmax is maximum temperature difference at Imax, Vmax and Qc = 0W)

Internal resistance = 0.45Ω ± 10% as measured by AC 4-terminal method at 25 °C

Operating temperature range: -50 °C ~ +200 °C (Solder melting point: +235 °C)

Thickness tolerance: ± 0.025mm (Lapping to ± 0.01mm for multi-module apps available.)
Flatness and parallel variance: ± 0.05mm

Standard lead wires: 22 AWG, Tin (Sn) plated at module interface, with a maximum temperature of +105 °C
(Other wiring options available.)

Ceramics: Alumina (AL2O3) - Available with metalized and tinned surfaces

Maximum recommended compression: 1MPa

A version for thermal cycling is available

The lot number is printed on the center of the cold-side

Comply with ROHS (Restriction of Hazardous Substances) and 2006/122/EC - PFOS (PerFluoroOctane Sulfonates)

Performance Curves with Th 27 °C

Click here for .pdf copy

TM 31-1.0-6.0 Performance Curves at 27 °C  

In a forced convection assembly the hot-side (Th) of the TEC is in contact with a heat-sink that will always have a temperature above ambient. This curve is particularly appropriate for the many applications operating in an ambient around 22 °C with a typical 5 °C increase in the temperature of the heat-sink.

 

Performance Curves with Th 50 °C

Click here for .pdf copy

TM  31-1.0-6.0 Performance Curves at 50 °C  

In a natural or forced convection assembly the hot-side (Th) of the TEC is in contact with a heat-sink that will always have a temperature above ambient. This curve is particularly appropriate for natural convection applications operating in an ambient around 20 °C with a 30 °C increase in the temperature of the heat-sink, a forced convection assembly within an instrument with marginal ventilation or an approximately 45 °C ambient temperature.

 

Prices

TM 31-1.0-6.0 Prices (September 1, 2017)

Option Prices and Designations (Suffix):
(for example: TM 31-1.0-6.0 "EL")

  • RTV edge sealing = "RTV" $1 per module
  • Epoxy edge sealing = "E" $2 per module
  • Lapping to ± 0.01mm = "L" (for multi-module apps) $2 per module