TM 71-1.0-4.0 Thermoelectric Module

TM 71-1.0-4.0
Thermoelectric Cooling Module

Specifications with Thot= 27°С

Part Number

Imax
A

Umax
V

Qcmax
W

∆Tmax
K

Dimensions (mm)
L x W x H

TM 71-1.0-4.0

3.9

8.8

18.7

70

20 x 20 x 3.6

Module Photo

TM 71-1.0-4.0

 

See tabs below for comprehensive information on TM 71-1.0-4.0

Multi-purpose module TM 71-1.0-4.0 is a popular 20 x 20mm cooler intended for use with 5 to 8.6 volt (DC) power sources. Its compact size, cooling capacity and relatively low heat ejection, make the module particularly popular where thermal loads are small and/or heatsinking space is limited.

Often used in electro-optic and photonic applications, including some lasers, detectors, sensors and LEDs, TM 71-1.0-4.0 is used to maintain a constant temperature and stabilize the wavelength of a device or package.

TM 71-1.0-4.0 may be used for cooling, heating and thermal stabilization and is employed in a wide range of applications including electro-optic/photonic, fiber optic, aerospace/military, telecommunications.

Available with metalized and tinned surfaces.

Specifications (Hot-Side Temperature 27 °C)

Imax = 3.9 Amps (Imax is the maximum current at ΔTmax)

Vmax = 8.8 Volts (Vmax is maximum voltage at ΔTmax)

Qcmax = 18.7 Watts (Qcmax is maximum cooling capacity at Imax, Vmax and ΔT = 0 °C)

ΔTmax = 70 °C (ΔTmax is maximum temperature difference at Imax, Vmax and Qc = 0W)

Internal resistance = 1.95 Ω ± 10% as measured by AC 4-terminal method at 25 °C

Operating temperature range: -50 °C ~ +200 °C (Solder melting point: +235 °C)

Thickness tolerance: ± 0.025mm (Lapping to ± 0.01mm for multi-module apps available.)
Flatness and parallel variance: ± 0.05mm

Standard lead wires: 22 AWG, Tin (Sn) plated at module interface, with a maximum temperature of +105 °C
(Other wiring options available.)

Ceramics: Alumina (AL2O3) - Available with metalized and tinned surfaces

Maximum recommended compression: 1MPa

A version for thermal cycling is available

The lot number is printed on the center of the cold-side

Comply with ROHS (Restriction of Hazardous Substances) and 2006/122/EC - PFOS (PerFluoroOctane Sulfonates)  

Performance Curves with Th 27 °C

Click here for .pdf copy

TM 71-1.0-4.0 Performance Curves with hot-side Temperature 27 °C  

In a forced convection assembly the hot-side (Th) of the TEC is in contact with a heat-sink that will always have a temperature above ambient. This curve is particularly appropriate for the many applications operating in an ambient around 22 °C with a 5 °C increase in the temperature of the heat-sink.

 

Performance Curves with Th 50 °C

Click here for .pdf copy

TM 71-1.0-4.0 Performance Curves at 50 °C  

In a natural or forced convection assembly the hot-side (Th) of the TEC is in contact with a heat-sink that will always have a temperature above ambient. This curve is particularly appropriate for natural convection applications operating in an ambient around 20 °C with a 30 °C increase in the temperature of the heat-sink, a forced convection assembly within an instrument with marginal ventilation or an approximately 45 °C ambient temperature.

 

Prices

TM 71-1.0-4.0 Prices (September 1, 2017)

Option Prices and Designations (Suffix):
(for example: TM 71-1.0-4.0 "EL")

  • RTV edge sealing = "RTV" $1 per module
  • Epoxy edge sealing = "E" $2 per module
  • Lapping to ± 0.01mm = "L"